A 300 mm silicon test wafer covered in chips

Electronics and thin film

Sputtering targets, evaporation materials and high-purity metals for thin-film and semiconductor work.

Targets

Pure metal, alloy, ceramic, oxide and chalcogenide targets, bonded or unbonded, for any system.

High purity

Twenty elements from 4N to 7N, including gallium, indium, tellurium and copper.

Powders

Nanopowders and oxide powders, including ITO.

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